Tashkent, Uzbekistan (UzDaily.uz) — Representatives of technology parks and innovation ecosystems from the Organization of Turkic States (OTS) discussed mechanisms for developing a unified innovation ecosystem and supporting startups.
The roundtable was held as part of ICT WEEK Uzbekistan 2026 and the OTS Technology Forum.
The event was attended by IT Park Uzbekistan Director General Azamat Karamatov, Astana Hub CEO Magzhan Madiyev, Astana Hub Ventures CEO Aidana Bergazdenova, High Technology Park of the Kyrgyz Republic Deputy CEO Chubak Temirov, Bilişim Vadisi Director of International Relations Sezen Güngör, and IDDA Supervisory Board Deputy Chairman Shahin Aliyev.
The participants focused on practical cooperation between the technology ecosystems of OTS countries. Key tasks included supporting startups, expanding their access to foreign markets and creating conditions for technology companies to scale.
The participants also discussed startup mobility mechanisms and soft landing programmes. These initiatives would enable startups to receive support when entering the markets of other OTS countries, become familiar with local technology ecosystems and establish contacts with potential partners.
The participants also considered creating a joint framework cooperation programme among technology parks. The discussion outlined potential priority initiatives, coordination mechanisms and further steps to implement joint projects.
Another area was support for technology projects through expanded access to financing. Ecosystem representatives discussed developing an investor network, co-investment mechanisms and prospects for creating joint investment instruments for startups across the OTS region.
The roundtable provided a platform for technology parks from OTS countries to exchange experience and discuss practical tools for regional cooperation.
Particular attention was paid to developing an interconnected innovation ecosystem that would enable startups to expand their presence in OTS markets and strengthen business ties between technology companies.
